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Recent Trends in VLSI and Semiconductor Packaging
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Recent Trends in VLSI and Semiconductor Packaging

Recent Trends in VLSI and Semiconductor Packaging

Buch (gebunden)ca. 266.00 CHF
lieferbar in ca. 10-20 Arbeitstagen

The Conference aimed to provide a platform for researchers, academicians, industry experts, and practitioners to exchange ideas, present research findings, and discuss emerging trends and challenges in the specified fields.

Mai 2025, ca. 616 Seiten, Englisch
Taylor and Francis
978-1-041-01786-8

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