Recent Trends in VLSI and Semiconductor Packaging
Recent Trends in VLSI and Semiconductor Packaging
Inhalt
The Conference aimed to provide a platform for researchers, academicians, industry experts, and practitioners to exchange ideas, present research findings, and discuss emerging trends and challenges in the specified fields.
Bibliografische Angaben
Mai 2025, 616 Seiten, Englisch
Taylor and Francis
978-1-041-01786-8