Practical Guide for the Reliable Packaging of Electronics
Practical Guide for the Reliable Packaging of Electronics
Thermal and Mechanical Design and Analysis
Von:Jamnia Ali
Inhalt
The fourth edition of Practical Guide to the Reliable Packaging of Electronics provides a comprehensive understanding of the thermal and mechanical aspects of electromechanical system design, along with insights into potential failures.
Bibliografische Angaben
Oktober 2025, ca. 352 Seiten, Englisch
Taylor and Francis
978-1-032-88114-0