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Cunningham Tim: Human Rights and the
Architecture of Conflict

Human Rights and the Architecture of Conflict

Prosecuting the Powerful: War Crimes and the Battle for Justice

Routledge Revivals

Book of Architecture

Germain Boffrand

Design for Healing Spaces

Therapeutic Gardens

Woodhead Publishing Series in Civil and Structural Engineering

Integrating Innovative Technologies for Civil and Structural Excellence

Smart Civil and Structural Engineering

Following the importance of understanding and asssessing geotechnical hazards, vulnerability and risk, new concepts and techniques of reliability analysis have been developed in the last 20 years. Though widely accepted, application has been slow. This book introduces basic principles and methods of geotechnical risk and reliability and demonstrates their relevance for improved understanding, more effective strategies and better problem-solving skills. Attention is given to the latest developments in the application to geotechnical problems and how reliability analysis and assessment of hazard and risk along with suitable observational approaches can facilitate the management of risk.

Geotechnical Risk and Reliability, an Introduction

Advanced Mechanics of Solids and Structures

A Realist’s Guide to the Economy and How We Can Fix it

Why We’re Getting Poorer

Construction Law in the United Arab Emirates and the Gulf

Structural Theory and Innovative Technologies for Concrete-Filled Steel Tubular Bridges

Rules of Thumb for Reservoir Engineers

Emerging Concepts and Technologies

Net Zero Transition in Buildings

Build the microchips of the future with this revolutionary new information transfer technology Advancements in high-performance computing have continually demanded for progresses in disruptive technological research and innovations. Moore's Law has pushed the Very Large Scale Integration (VLSI) technology to pack MOS devices inside a chip at an exponential rate, thereby surpassing now eight billion transistors per cm2. This has concomitantly fueled the growth of multilayered on-chip interconnects comprising metallic and low dielectric materials. VLSI Interconnect Technology with Artificial Plasmonics introduces a new method for improving chip performance by harnessing the power of information transfer among chips at terahertz frequency. This revolutionary new electromagnetic wave engineering, called a spoof surface plasmon polariton, adapts the principles of VLSI and terahertz interconnect technology along with the artificial plasmonics to transfer huge quantities of data at vastly improved speeds. It constitutes a potentially decisive contribution to the pursuit of faster and more capacious VLSI chips. In VLSI Interconnect Technology with Artificial Plasmonics, readers will also find: <ul> <li>A cutting-edge new approach supported by pioneering research</li> <li>Detailed discussion of essential components related to the development of THz interconnect technology, including theory, modeling, simulation, and validation</li> <li>Roadmap to future technological development in the branch of artificial plasmonics</li> </ul> VLSI Interconnect Technology with Artificial Plasmonics is ideal for engineers, researchers, and scientists working in electronics, electromagnetics, and optics.

Bridging the Gap between Electronics and Optics

VLSI Interconnect Technology with Artificial Plasmonics

Human Rights and the Architecture of Conflict

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