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CMOS Plasma and Process Damage

CMOS Plasma and Process Damage

Contenu

This book discusses the complex technology of building CMOS computer chips and covers some of the unusual problems that can occur during chip manufacturing. Readers will learn how plasma and process damage results from the high-energy processes that are used in chip manufacturing, causing harm to the chips, functional failure and reliability problems. 

  • Provides an up-to-date, single-source reference on CMOS plasma and process damage, for engineers from all disciplines
  • Offers concise, comprehensive coverage, discussing real problems with necessary background for working engineers
  • Applies to design, layout, mask making, lithography, process and device engineering, testing and reliability

Informations bibliographiques

mai 2025, 466 pages, Anglais
Springer International Publishing
978-3-031-89028-4

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