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CMOS Plasma and Process Damage

CMOS Plasma and Process Damage

Inhalt

This book discusses the complex technology of building CMOS computer chips and covers some of the unusual problems that can occur during chip manufacturing. Readers will learn how plasma and process damage results from the high-energy processes that are used in chip manufacturing, causing harm to the chips, functional failure and reliability problems. 

  • Provides an up-to-date, single-source reference on CMOS plasma and process damage, for engineers from all disciplines
  • Offers concise, comprehensive coverage, discussing real problems with necessary background for working engineers
  • Applies to design, layout, mask making, lithography, process and device engineering, testing and reliability

Bibliografische Angaben

Juni 2025, ca. 378 Seiten, Englisch
Springer International Publishing
978-3-031-89028-4

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