Introduction to Microelectronics Advanced Packaging Assurance
Inhalt
This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions.
In addition, this book:
o Provides a thorough introduction to IC packaging evolution and prospects, from historical evolution to emerging trends
o Includes case studies and examples, bridging theoretical knowledge with real applications for professionals
o Explores quantum computing integration and wearable device packaging, offering insight into future industry directions