Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
Thermal and Structural Electronic Packaging Analysis for Space and ...
Contenu
This book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.
Informations bibliographiques
août 2024, 290 pages, Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems, Anglais
Taylor and Francis
978-1-032-16085-6