Direct Copper Interconnection for Advanced Semiconductor Technology
Publié par:
Shangguan DongkaiIn the "More than Moore" era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.
juin 2024, env. 448 pages, Anglais
Taylor and Francis
978-1-03-252823-6
Taylor and Francis
978-1-03-252823-6

