Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Contenu
The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.
Informations bibliographiques
octobre 2024, 382 Pages, Anglais
Taylor and Francis
978-0-367-63588-6