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Electronic Materials Innovations and Reliability in Advanced Memory Packaging
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Electronic Materials Innovations and Reliability in Advanced Memory Packaging

Electronic Materials Innovations and Reliability in Advanced Memory ...

Livre (relié)env. 188.00 CHF
paraît en août

This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD). The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.

août 2025, env. 178 pages, Springer Series in Reliability Engineering, Anglais
Springer International Publishing
978-3-031-94794-0

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